The fatigue and damage of solder joints and also the potential for interface failure within BGA packages are caused by thermal cycling. In case of portable electronic products, fatigue is caused by repetitive drop and shock during transportation, or vibrations experienced in land-vehicles, air-planes, ships etc. The solder joint failure can then be attributed to the structural dynamics of the product. Therefore there is a need to develop predictive techniques for electronic failure mechanisms in shock and drop-impact. Deformation kinematics of printed circuit board assembly using high-speed imaging has been studied. Explicit finite element models are developed for fine-pitch BGAs using smeared property approach and validated with experimental results. Damage proxies for failure mechanisms at the copper-to-solder, solder-to-printed circuit board and copper-to-package substrate have been developed. 3-D Digital Image Correlation technique have been explored using ultra-high speed camera to study full-field strain and deformation of PCB populated with packages in shock/vibration testing. SPR technique has been used to evaluate reliability degradation of electronic assemblies.

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