Издательство: | Книга по требованию |
Дата выхода: | июль 2011 |
ISBN: | 978-6-1325-1335-9 |
Объём: | 84 страниц |
Масса: | 147 г |
Размеры(В x Ш x Т), см: | 23 x 16 x 1 |
High Quality Content by WIKIPEDIA articles! Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by chemical or electrochemical means. This article covers methods used in the modern electronics industry; more traditional methods, often used for much larger objects, are covered in gilding. There are several types of gold plating used in the electronics industry. Soft, pure gold plating is used in the semiconductor industry. The gold layer is easily soldered and wire bonded. Its Knoop hardness ranges between 60-85. The plating baths have to be kept free of contamination. Bright hard gold on contacts, with Knoop hardness between 120-300 and purity of 99.7-99.9% Au. Often contains a small amount of nickel and/or cobalt; these elements interfere with die bonding, therefore the plating baths can't be used for semiconductors. Bright hard gold on printed circuit board tabs is deposited using lower concentration of gold in the baths.
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