Process Corners

Process Corners

Lambert M. Surhone, Mariam T. Tennoe, Susan F. Henssonow

     

бумажная книга



Издательство: Книга по требованию
Дата выхода: июль 2011
ISBN: 978-6-1336-8201-6
Объём: 88 страниц
Масса: 153 г
Размеры(В x Ш x Т), см: 23 x 16 x 1

High Quality Content by WIKIPEDIA articles! In semiconductor manufacturing, a process corner is an example of a design-of-experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners represent the extremes of these parameter variations within which a circuit that has been etched onto the wafer must function correctly. A circuit running on devices fabricated at these process corners may run slower or faster than specified and at lower or higher temperatures and voltages, but if the circuit does not function at all at any of these process extremes the design is considered to have inadequate design margin. Corner-lot analysis is most effective in digital electronics because of the direct effect of process variations on the speed of transistor switching during transitions from one logic state to another, which is not relevant for analog circuits, such as amplifiers.

Данное издание не является оригинальным. Книга печатается по технологии принт-он-деманд после получения заказа.

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