Sensor Based Modeling of Copper Chemical Mechanical Planarization. Modeling the slurry chemistry effects on Material Removal Rate (MRR)

Sensor Based Modeling of Copper Chemical Mechanical Planarization. Modeling the slurry chemistry effects on Material Removal Rate (MRR)

Upendra Phatak

     

бумажная книга



Издательство: Книга по требованию
Дата выхода: июль 2011
ISBN: 978-3-6391-3371-4
Объём: 132 страниц
Масса: 221 г
Размеры(В x Ш x Т), см: 23 x 16 x 1

The variations in slurry chemistry parameters including pH, concentrations of complexing and corrosion inhibiting agents, and slurry flow rates as well as average MRR in Cu-CMP process are modeled using features from two vibration sensors (one wired and the other wireless accelerometer). The study is perhaps one of the first efforts to use wireless vibration sensors for real-time monitoring of MRR and the chief slurry chemistry parameters in CMP. We hope that this work will lead to the advent of physics-based process-machine interaction (PMI) models that can be used to delineate the various process behaviors, which in turn can be used to select vibration signal features that are more sensitive to variations in MRR and other quality and performance variable of the CMP process. The study has delineated the joint (i.e., statistical interaction) effects of various slurry components on MRR in Cu-CMP. In specific, the joint effects of the complexing agent with other input parameters, such as pH and flow rate (i.e., two-way interactions) on MRR have been found to be significant.

Данное издание не является оригинальным. Книга печатается по технологии принт-он-деманд после получения заказа.

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