High Quality Content by WIKIPEDIA articles! Solder paste (or solder cream) is used for connecting the terminations of integrated chip packages with land patterns on the printed circuit board. The paste is applied to the lands by printing the solder using a stencil, while other methods like screening and dispensing are also used. A majority of defects in mount assemblies are caused due to the issues in printing process or due to defects in the solder paste. An electronics manufacturer needs to have a good idea about the printing process, specifically the paste characteristics, to avoid reworking costs on the assemblies. Characteristics of the paste, like viscosity and flux levels, need to be monitored periodically by performing in-house tests.

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