Stress Analysis of Bonded Assemblies: Applications in Microelectronics. Axisymmetric Assemblies under Thermal Loading

Stress Analysis of Bonded Assemblies: Applications in Microelectronics. Axisymmetric Assemblies under Thermal Loading

Shilak Shakya

     

бумажная книга



Издательство: Книга по требованию
Дата выхода: июль 2011
ISBN: 978-3-6390-6032-4
Объём: 256 страниц
Масса: 411 г
Размеры(В x Ш x Т), см: 23 x 16 x 2

Four analytical models are developed for predicting the maximum shearing displacement in a bonded assembly under global thermal mismatch loading. Analytical model includes: i) elastic analysis, ii) elasto-plastic analysis, iii) viscoelastic analysis, and iv) viscoelastic-plastic analysis. All results have been derived as closed-form correction factors to be applied to the easily calculated unconstrained shear displacement to obtain the maximum shear displacement. The motivation for determining the maximum shear displacement is to compute the maximum shear strain, which is then used to estimate the cycles-to-failure by means of a fatigue law. The analytical relations derived are simple, easy-to-use, and helpful for studying the interaction among the various design parameters. The analytical relations are in good agreement with existing experimental and numerical results.

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