Surface-Mount Technology

Surface-Mount Technology

Lambert M. Surhone, Miriam T. Timpledon, Susan F. Marseken

     

бумажная книга



Издательство: Книга по требованию
Дата выхода: июль 2011
ISBN: 978-6-1310-0151-2
Объём: 72 страниц
Масса: 129 г
Размеры(В x Ш x Т), см: 23 x 16 x 1

High Quality Content by WIKIPEDIA articles! Surface-mount technology (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface-mount devices or SMDs. In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

Данное издание не является оригинальным. Книга печатается по технологии принт-он-деманд после получения заказа.