The process of implementing thin film technology brings forth the need for characterization of their mechanical properties with increasing accuracy. Design and performance parameters for a micro-tensile test apparatus capable of applying a tensile load of up to 20N with a force and displacement resolution of ~1 mN and ±0.3 µm respectively have been presented. The device is well suited for conducting micro-tensile testing on a variety of specimens with high aspect ratios. The apparatus was used to measure Young’s modulus of 1 µm thick Al films deposited on Kapton® polyimide substrates. Average value of E(Aluminum) was found to be around 30±5 GPa. Use of the testing scheme employed has been validated using analytical and finite element methods. Use of Digital Image Correlation as a strain measurement tool has also been investigated. The device was mounted on an optical microscope for capturing digital images of the specimen undergoing strain. Results show that coupled with appropriate software, the method can significantly help reduce data collection and analysis burden.

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