The increasing demand of miniature mechanical devices and systems for applications in electronics, biotechnology, and environmental monitoring, requires novel manufacturing processes. Microforming is well suited for miniaturization because of higher productivity, accuracy and minimum material loss. Despite the advantages of microforming, full utilization of this process has not been realized yet. Some of the technical challenges related with miniaturization that need to be addressed before microforming can become commercially viable are material flow behavior, higher friction, and fabrication of micro-tools. This monograph presents ultrasonic technology as a method of overcoming some of these challenges. The ultrasonic technology can improve the quality of microformed parts by enhancing the tribological conditions, increasing surface integrity, and reducing the forming forces, thus prolonging tool life. Various issues are addressed in the monograph including the physics of the ultrasonic microforming process, prediction of heat generation due to ultrasonic vibration and the application of finite element analysis in designing an ultrasonic microforming system.

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